Thermoelectric devices and methods for forming thermoelectric devices

A method for forming a thermoelectric device, the method comprising:

• forming a plurality of first semiconductor mesa structures at a first semiconductor substrate, the first semiconductor substrate having a first conductivity type;
• forming a plurality of second semiconductor mesa structures at a second semiconductor substrate, the second semiconductor substrate having a second conductivity type;
• arranging a glass substrate between the first semiconductor substrate and the second semiconductor substrate;
• and
• applying at least one of heat and pressure to the glass substrate to deform the glass substrate so that at least a portion of the glass substrate is moved between first semiconductor mesa structures of the plurality of first semiconductor mesa structures and second semiconductor mesa structures of the plurality of second semiconductor mesa structures, to connect the first semiconductor substrate to the second semiconductor substrate.