Semiconductor devices
AssigneeSamsung Electronics Co., Ltd.
InventorsKwangyoung Jung, Jongwon Kim, Dongseog Eun, Joonhee Lee
Life of this patent
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Abstract
Semiconductor devices are provided. A semiconductor device includes a substrate. The semiconductor device includes a stack structure including conductive layers stacked on the substrate. Moreover, the semiconductor device includes a dummy structure penetrating a stepped region of the stack structure. A portion of the dummy structure includes a first segment and a second segment. The first segment extends in a first direction in a plane parallel to an upper surface of the substrate. The second segment protrudes from the first segment in a second direction, in the plane, that intersects the first direction.
Claims20
A semiconductor device comprising:
- a substrate comprising a cell array region and a connection region;
- a stack structure comprising a plurality of conductive layers stacked on the substrate, a first one of the plurality of conductive layers comprising a pad region that protrudes relative to an overlying second one of the plurality of conductive layers on the connection region;
- a vertical structure on the cell array region and penetrating the stack structure;
- a plurality of support structures penetrating the pad region, the plurality of support structures each adjacent to an edge of the pad region;
- and
- a contact plug connected with a center of the pad region,
- wherein a first shape of a first portion of the plurality of support structures in a first plane is different from a second shape of a second portion of the plurality of support structures in a second plane, and the first plane and the second plane are parallel to an upper surface of the substrate, and
- wherein, in a horizontal cross-sectional view, the first shape of the first portion of the plurality of support structures in the first plane comprises an elliptical shape comprising a major axis that intersects a first direction that is toward the contact plug.
A semiconductor device comprising:
- a substrate;
- a stack structure comprising conductive layers stacked on the substrate, a first one of the conductive layers comprising a pad region that protrudes relative to an overlying second one of the conductive layers in a stepped region of the stack structure;
- a support structure penetrating the pad region on the stepped region of the stack structure;
- and
- a contact plug comprising a conductive material that is on a center of the pad region,
- wherein the support structure comprises an elliptical shape, in a horizontal cross-sectional view, comprising a minor axis that extends in a first direction toward the center of the pad region,
- wherein the support structure is provided in plurality, and the plurality of support structures are each adjacent to an edge of the pad region, and
- wherein, in a horizontal cross-sectional view, the contact plug is located between the plurality of support structures.
Dependencies are inferred from the claim text.