Cooling system for an electronic circuit module
AssigneeHewlett Packard Enterprise Development LP
InventorsJohn Norton, Kevin B. Leigh
Life of this patent
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Abstract
Examples described herein relate to cooling system for an electronic circuit module. The cooling system includes a frame disposable on the electronic circuit module and comprising a plurality of compartments defined by compartment walls. The cooling system further includes a plurality of cold plates disposed in the plurality of compartments of the frame and in thermal contact with the electronic circuit module, wherein the plurality of cold plates includes one or more passages to allow flow of a coolant there-through to conduct heat away from the electronic circuit module. Further, the one or more cold plates of the plurality cold plates include a guide feature to allow vertical movement of the one or more cold plates in respective compartments.
Claims20
A cooling system for an electronic circuit module, the cooling system comprising:
- a frame disposable on the electronic circuit module and comprising a plurality of compartments defined by compartment walls;
- and
- a plurality of cold plates disposed in the plurality of compartments of the frame and in thermal contact with the electronic circuit module, wherein the plurality of cold plates comprises one or more passages to allow flow of a coolant there-through to conduct heat away from the electronic circuit module, and wherein one or more cold plates of the plurality of cold plates are vertically movable relative to the frame and comprise respective guide features to guide vertical movement of the one or more cold plates relative to the frame in respective compartments of the plurality of compartments,
- wherein the vertical movement comprises movement toward or away from the electronic circuit module in a state of the frame disposed on the electronic circuit module.
A circuit assembly, comprising:
- an electronic circuit module comprising a plurality of electronic components disposed on a circuit board such that top surfaces of the plurality of electronic components are positioned at varying heights;
- and
- a cooling system disposed on the electronic circuit module, the cooling system comprising:
- a frame comprising a plurality of compartments defined by compartment walls;
- and
- a plurality of cold plates disposed in the plurality of compartments of the frame and in thermal contact with the one or more of the plurality of electronic components, wherein the plurality of cold plates comprises one or more passages to allow flow of a coolant there-through to conduct heat away from the electronic circuit module, and wherein one or more cold plates of the plurality of cold plates are vertically movable relative to the frame and comprise respective guide features to guide vertical movement of the one or more cold plates relative to the frame in respective compartments of the plurality of compartments so that the one or more cold plates are seated at varying heights on the top surfaces of respective ones of the plurality of electronic components,
- wherein the vertical movement comprises movement toward or away from the electronic circuit module in a state of the frame disposed on the electronic circuit module.
A method of assembling a cooling system of a circuit assembly, the method comprising:
- providing a frame that is disposable on an electronic circuit module of the circuit assembly and comprising a plurality of compartments defined by compartment walls, wherein one or more of the compartment walls forming a compartment of the plurality of compartments comprise a guide slot;
- and
- disposing a plurality of cold plates in the plurality of compartments of the frame and in thermal contact with the electronic circuit module, wherein the plurality of cold plates comprises one or more passages to allow flow of a coolant there-through to conduct heat away from the electronic circuit module, and wherein one or more cold plates of the plurality of cold plates are vertically movable relative to the frame and comprise respective guide features that are received into respective guide slots to guide vertical movement of the one or more cold plates relative to the frame in respective compartments of the plurality of compartments,
- wherein the vertical movement comprises movement toward or away from the electronic circuit module in a state of the frame disposed on the electronic circuit module.
Dependencies are inferred from the claim text.