Heat dissipator and communications device
AssigneeHuawei Technologies Co., Ltd.
InventorHui Jia
Life of this patent
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Abstract
Embodiments of this application relate to a heat dissipator including a cover plate, an orifice plate, and a base plate that are stacked in sequence. A distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, and the distribution cavity communicates with the heat exchange cavity by using through holes disposed on the orifice plate. A plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the pin fins include a combination pin fin in contact with the orifice plate, and a flow guiding pin fin that corresponds to the through hole and that has a gap with the through hole.
Claims20
A heat dissipator, comprising:
- a cover plate;
- an orifice plate having through holes disposed thereon;
- and
- a base plate, wherein
- the cover plate, the orifice plate, and the base plate are configured to be stacked in sequence,
- a distribution cavity is disposed between the orifice plate and the cover plate,
- a heat exchange cavity is disposed between the orifice plate and the base plate,
- the distribution cavity is configured to communicate with the heat exchange cavity by using the through holes disposed on the orifice plate, and
- a plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the plurality of pin fins comprise:
- a plurality of combination pin fins in contact with the orifice plate, and
- a plurality of flow guiding pin fins associated with a through hole of the through holes and having a gap with the through hole, wherein
- heights of the plurality of combination pin fins are greater than heights of the plurality of flow guiding pin fins.
A communications device, comprising:
- a heat emitting apparatus;
- and
- a heat dissipator, wherein
- the heat dissipator comprises:
- a cover plate;
- an orifice plate having through holes disposed thereon;
- and
- a base plate in contact with the heat emitting apparatus, wherein
- the cover plate, the orifice plate, and the base plate are configured to be stacked in sequence,
- a distribution cavity is disposed between the orifice plate and the cover plate,
- a heat exchange cavity is disposed between the orifice plate and the base plate,
- the distribution cavity is configured to communicate with the heat exchange cavity by using the through holes disposed on the orifice plate, and
- a plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the plurality of pin fins comprise:
- a plurality of combination pin fins in contact with the orifice plate, and
- a plurality of flow guiding pin fins associated with a through hole of the through holes and having a gap with the through hole, wherein
- heights of the plurality of combination pin fins are greater than heights of the plurality of flow guiding pin fins.
Dependencies are inferred from the claim text.