Conductive PVD stack-up design to improve reliability of deposited electrodes

A housing for an electronic device, comprising:

• a conductive film deposited on a first surface of the housing and extending around a peripheral edge of the housing at least partially onto a second surface of the housing opposite the first surface;
• a non-metallic film layer deposited on the second surface and at least partially over a portion of the conductive film deposited on the second surface;
• and
• the conductive film and the film layer forming an electrically conductive pathway extending from the first surface to the second surface.

A method of forming a housing component, comprising:

• depositing a first conductive layer on a first surface of the housing component;
• depositing a second conductive layer on a second surface of the housing component opposite the first surface, the second conductive layer at least partially overlapping the first conductive layer at a peripheral edge of the housing;
• and
• depositing a third layer over the second conductive layer.