Manufacturing method of printed circuit board

A manufacturing method of printed circuit board, comprising:

• obtaining a composite anti-glue film assembly;
• providing at least two core plates;
• arranging the composite anti-glue film assembly at a preset core position of one of the at least two core plates, the composite anti-glue film assembly comprises a first anti-glue film layer, a second anti-glue film layer and a bonding layer that are bonded to each other, the first anti-glue film layer is configured to contact the preset core position;
• the bonding layer is configured to bond the first anti-glue film layer and the second anti-glue film layer together to form the composite anti-glue film assembly;
• connecting a first core plate and a second core plate of the at least two core plates through a medium layer, the composite anti-glue film assembly is arranged between the first core plate and the second core plate;
• and
• cutting out the second core plate to define an opening and exposing the preset core position by removing the composite anti-glue film assembly, the second core plate, and the medium layer from the preset core position,
• the operation of obtaining the composite anti-glue film assembly comprises:
• providing a first adhesive tape layer and a second adhesive tape layer, the first adhesive tape layer comprises a first polyimide layer and a first adhesive layer that are bonded to each other, the second adhesive tape layer comprises a second polyimide layer and a second adhesive layer that are bonded to each other;
• oppositely arranging and bonding the first adhesive layer of the first adhesive tape layer and the second adhesive layer of the second adhesive tape layer to produce the multiple-layer adhesive tape layer;
• and
• processing a preset tape position of the multiple-layer adhesive tape layer to produce the composite anti-glue film assembly,
• wherein the first polyimide layer of the first adhesive tape layer forms the first anti-glue film layer of the composite anti-glue film assembly, the second polyimide layer of the second adhesive tape layer forms the second anti-glue film layer, the first adhesive layer forms a first bonding layer, and the second adhesive layer forms a second bonding layer, the first bonding layer and the second bonding layer form the bonding layer of the composite anti-glue film assembly.