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US 11,641,718 B2Granted
Electromagnetic compatibility contact between metal castings and printed circuit boards
AssigneeHarman International Industries, Incorporated
InventorsJianing Chen, Jon Curry, David Jia
Life of this patent
Estimating the term…
Abstract
An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.
Claims6
An electronic device comprising:
- at least one circuit board having a predetermined pattern of solder bumps facilitating a ground connection;
- and
- a first enclosure member and a second enclosure member, wherein the at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom, the bead contacts the predetermined pattern of solder bumps to complete the ground connection.
Dependencies are inferred from the claim text.