Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsEun Sun Kim, Jin Uk Lee, Young Hun You, Chi Seong Kim
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes a first insulating layer; a protective filler layer disposed on one surface of the first insulating layer; a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer; a first via passing through the first insulating layer and contacting the pad; and a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.
Claims20
A printed circuit board comprising:
- a first insulating layer;
- a protective filler layer disposed on one surface of the first insulating layer;
- a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer, such that the protective filler layer covers at least a portion of a side surface of the first wiring layer;
- a first via passing through the first insulating layer and contacting the pad;
- and
- a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.
A printed circuit board comprising:
- a first insulating layer;
- a protective filler layer disposed on one surface of the first insulating layer;
- a first wiring layer disposed on the one surface of the first insulating layer and having a pad, such that the protective filler layer covers at least a portion of a side surface of the first wiring layer;
- a first via passing through the first insulating layer and connected to the pad;
- and
- a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively,
- wherein the first insulating layer and the second insulating layer are separated from each other by the protective filler layer and the first wiring layer.
Dependencies are inferred from the claim text.