Circuit board ground via patterns for minimizing crosstalk between signal vias

A method, comprising:

• forming a first signal via electrically coupled to two or more layers of a circuit board;
• forming a second signal via electrically coupled to two or more layers of the circuit board;
• forming a third signal via integral to a signal pair comprising the first signal via and the third signal via;
• forming a pair of ground vias configured to provide electrical shielding between the first signal via and the second signal via, the pair of ground vias comprising:
• a first ground via electrically coupled to either a ground plane or a power plane of the circuit board;
• and
• a second ground via electrically coupled to either the ground plane or the power plane of the circuit board;
• and
• arranging the first signal via, the first ground via, and the second ground via such that they form an angle of approximately 50 degrees having a vertex at the first signal via, a first ray extending from the first signal via through the first ground via and a second ray extending from the first signal via through the second ground via.

An information handling system comprising:

• an enclosure;
• and
• a circuit board housed in the enclosure, the circuit board comprising:
• a first signal via electrically coupled to two or more layers of the circuit board;
• a second signal via electrically coupled to two or more layers of the circuit board;
• a third signal integral to a signal pair comprising the first signal via and the third signal via;
• and
• a pair of ground vias configured to provide electrical shielding between the first signal via and the second signal via, the pair of ground vias comprising:
• a first ground via electrically coupled to either a ground plane or a power plane of the circuit board;
• and
• a second ground via electrically coupled to either the ground plane or the power plane of the circuit board;
• wherein the first signal via, the first ground via, and the second ground via are arranged such that they form an angle of approximately 50 degrees having a vertex at the first signal via, a first ray extending from the first signal via through the first ground via and a second ray extending from the first signal via through the second ground via.