Connecting thermally-sprayed layer structures of heating devices

A domestic appliance, comprising:

• a heating device, said heating device comprising a planar carrier having an insulating carrier surface,
• a first metallic layer structure thermally sprayed directly onto the insulating carrier surface, and
• a first volume of solder ultrasonically melted onto both the metallic layer structure and the insulating carrier surface, wherein the first volume of solder electrically connects the first layer structure to another component of the heating device, the other component is a second metallic layer structure thermally sprayed onto the carrier surface;
• and
• the first volume of solder is applied to the second metallic layer structure.

A method for producing a heating device for a domestic appliance, said method comprising:

• thermally spraying a first metallic layer structure directly onto a planar carrier having an insulating carrier surface,
• ultrasonically soldering a first volume of solder onto both the metallic layer structure and the insulating carrier surface, wherein ultrasonically soldering includes melting the volume of solder, and
• ultrasonically soldering the first layer structure in two stages to another component of the heating device, with a first one of the two stages representing the ultrasonic soldering of the first volume of solder onto the layer structure, and with a second one of the two stages including soldering the first volume of solder to the other component of the heating device,
• wherein the other component of the heating device is a second layer structure that is thermally sprayed onto the planar carrier;
• and
• wherein in the second of the two stages the first volume of solder is soldered to a second ultrasonically applied volume of solder of the heating device.