US 11,641,072 B2 · PCB-pinout based packaged module and method for preparing PCB-pinout based packaged module

Abstract

This application relates to the field of power supply packaging technologies, and in particular, to a PCB-pinout based packaged module, including a packaged module and a pin exposed outside the packaged module. The packaged module includes a PCB and a power component. The PCB has a first surface and a second surface that are disposed opposite to each other, and the power component is disposed on the first surface or the second surface of the PCB. The power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB. The pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module.

Claims11

Dependent claims

A PCB-pinout based packaged module, comprising:

a printed circuit board (PCB) having a first surface and a second surface disposed opposite the first surface;
and
a power component disposed on the first surface or the second surface of the PCB;
wherein the power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB;
and
wherein the pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module;
and
wherein there are two or more pins, and the PCB between the two or more pins is provided with an opening to form at least one sprue.

5 more elements

A method for manufacturing a PCB-pinout based packaged module, comprising:

etching surface-layer copper that is of a first surface or a second surface of a printed circuit board (PCB) and that is on an edge part of the PCB, to obtain more than two pins;
performing, by a power component, communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through the surface-layer copper of the PCB;
packaging the PCB and the power component, and exposing the more than two pins outside a packaged module;
and
before the packaging the PCB and the power component, and exposing the more than two pins outside the packaged module, the method further comprises:
opening the PCB between the more than two pins, to dispose a sprue.

3 more elements

Dependencies are inferred from the claim text.

PCB-pinout based packaged module and method for preparing PCB-pinout based packaged module

Life of this patent

PCB-pinout based packaged module and method for preparing PCB-pinout based packaged module

Life of this patent

Abstract

Claims11