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US 11,641,002 B2Granted
Optical transmission/reception circuit
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsAlexandre Coullomb, Romain Coffy, Jean-Michel Riviere
Life of this patent
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Abstract
A device includes a substrate and an optoelectronic chip buried in the substrate. The substrate may include an opening above a first optical transduction region of the first optoelectronic chip and above a second optical transduction region of a second optoelectronic chip.
Claims19
A method, comprising:
- forming a first optoelectronic chip with a first optical transduction region;
- and
- burying the first optoelectronic chip in a substrate;
- forming a protection layer on the first optical transduction region of the first optoelectronic chip;
- forming an opening in the substrate directly above the protection laver;
- and
- removing the protection layer after forming the opening.
4 more elements
A method, comprising:
- positioning a first optoelectronic chip in a substrate, the first optoelectronic chip including a first optical transduction region, the substrate having a first surface;
- positioning a second optoelectronic chip in the substrate, the second optoelectronic chip including a second optical transduction region and a third optical transduction region;
- forming a first opening extending into the substrate from the first surface, the first opening extending over the first optical transduction region and the second optical transduction region, and
- forming a second opening extending into the substrate from the first surface, the second opening extending over the third optical transduction region.
1 more element
A method, comprising:
- forming a first internal cavity and a second internal cavity in a first substrate layer;
- positioning a first optoelectronic chip in the first internal cavity;
- positioning a second optoelectronic chip in the second internal cavity;
- forming a second substrate layer on the first substrate layer and at least partially covering the first optoelectronic chip and the second optoelectronic chip;
- forming a first opening extending into the second substrate layer from an upper surface of the second substrate layer, the first opening extending over a first optical transduction region of the first optoelectronic chip and a second optical transduction region of the second optoelectronic chip;
- and
- forming a second opening extending into the second substrate layer from the upper surface, the second opening extending over a third optical transduction region of the second optoelectronic chip.
4 more elements
Dependencies are inferred from the claim text.