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US 11,638,370 B1Granted
Method and apparatus for a shielding structure of surface-mount LTCC devices
AssigneeScientific Components Corporation
InventorAaron Vaisman
Life of this patent
Estimating the term…
Abstract
An apparatus and method for a shielding structure for surface-mount LTCC components and filters to increase the signal isolation from input signal port to output signal port. An LTCC filter device with an increased rejection of undesired frequencies in a stopband and minimal distortion or loss of desired signals in a passband.
Claims15
An apparatus for shielding comprising:
- a structure having continuous metal at least partially around a circumference thereof, and having at least one radial side extending to a flat coplanar surface, where said radial side has one or more open first apertures to an interior of the structure, and said flat coplanar surface is a printed circuit board with a ground plane, and
- wherein said structure having continuous metal is a paste comprising a metal content;
- wherein said structure at least partially encloses a surface mount device attached to said printed circuit board;
- attachment of said structure to said ground plane, by at least an electrically operable attachment;
- two or more second apertures having relief of said continuous metal extending from the interior to an exterior of said structure, each in a separate plane, each said separate plane perpendicular to said flat coplanar surface;
- and
- attachment of one or more leads of said enclosed surface mount device to one or more transmission lines on said printed circuit board by protruding through at least one of said one or more open first apertures and said two or more second apertures.
4 more elements
An apparatus for shielding a low temperature co-fired ceramic (LTCC) component comprising:
- a metallic rectangular prism solid structure having continuous metal around a radial circumference thereof, wherein said metallic rectangular prism solid structure is electrically connected to one or more metallic attachment points of a device enclosed by said metallic rectangular prism solid structure, and wherein said metallic rectangular prism solid structure has on at least one radial side a smooth and flat surface for mounting to a co-planar ground plane of a printed circuit board;
- two or more apertures coplanar to said smooth and flat surface of said metallic rectangular prism solid structure extending from an interior to an exterior of said metallic rectangular prism solid structure, each encompassing metallic electrical signal input and output terminal ports electrically connected to corresponding input and output ports of an enclosed LTCC electrical circuit, and electrically isolated from said enclosed metallic rectangular solid structure;
- one or more cavities positioned radially outward from said enclosed LTCC electrical circuit and further positioned on an opposing side from said smooth and flat surface to operably reduce electrical capacitance of said input and output terminal ports;
- and
- one or more cylindrical volumes of removed metal interior to, and residing within a wall of, said metallic rectangular solid structure to capture solder flow of a reflow process and prevent said solder flow from flowing across said enclosed LTCC electrical circuit or said printed circuit board.
2 more elements
A method of constructing an apparatus comprising:
- constructing a rectangular solid structure having continuous metal around a radial circumference thereof, having at least one radial side extending to a coplanar flat surface for mounting on a printed circuit board, and having at least two apertures along an axis parallel to a longitudinal axis;
- and
- attaching of interior attachment points of said structure to electrical circuit ground;
- wherein said at least two apertures include one or more metallic elements extending from an interior to an exterior of said structure and are electrically disconnected from said continuous metal, each of said at least two apertures individually electrically connected to distinct metallic attachment points of said enclosed device.
1 more element
Dependencies are inferred from the claim text.