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US 11,638,359 B2Granted
Low profile power module package
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsDanny Lohan, Shailesh N. Joshi
Life of this patent
Estimating the term…
Abstract
Methods, systems, and apparatus for a module electronics package. The modular electronics package includes a main circuit. The first main circuit board is configured to provide electrical interconnections to form an electric circuit. The modular electronics package includes a first power module. The first power module includes a first power device card and a first expansion slot. The first power device card is configured to be inserted into the first expansion slot and to be electrically coupled to the main circuit board via the first expansion slot.
Claims14
A modular electronics package, comprising:
- a main circuit being configured to provide electrical interconnections to form an electric circuit with a power inverter;
- and a first power module including a first power device card and a first expansion slot, the first power device card being configured to be inserted into the first expansion slot and to be electrically coupled to the main circuit board via the first expansion slot, wherein the first power device card has a plurality of leads including a first lead and a second lead and a plurality of semiconductor devices including a first semiconductor device, a second semiconductor device, and a third semiconductor device, wherein the first semiconductor device and the second semiconductor device are positioned on the first lead and the third semiconductor device is positioned on the second lead, wherein the first semiconductor device and the second semiconductor device are positioned adjacent to each other and widthwise along a width of the first lead proximal to a power input to reduce loop inductance.
An electronics package, comprising:
- a power device card including a plurality of printed circuit boards and a plurality of semiconductor devices;
- an expansion slot configured to receive the first power device card;
- and a main circuit being configured to provide electrical interconnections to form an electric circuit with an inverter of a vehicle, wherein the power device card has a plurality of leads including a first lead and a second lead and the plurality of semiconductor devices include a first semiconductor device, a second semiconductor device, and a third semiconductor device, wherein the first semiconductor device and the second semiconductor device are positioned on the first lead and the third semiconductor device is positioned on the second lead, wherein the first semiconductor device and the second semiconductor device are positioned adiacent to each other and widthwise along a width of the first lead proximal to a power input of a printed circuit board of the plurality of printed circuit boards to reduce loop inductance.
A modular electronics package, comprising:
- a main circuit having a first expansion slot and a second expansion slot, the main circuit being configured to provide electrical interconnections to form an electric circuit;
- a first power device card being configured to be inserted into the first expansion slot and to be electrically coupled to the main circuit via the first expansion slot;
- and a second power device card being configured to be inserted into the second expansion slot and to be electrically coupled to the main circuit via the second expansion slot, the second power device card being interchangeable with the first power device card, wherein the first power device card has a plurality of leads including a first lead and a second lead and a plurality of semiconductor devices including a first semiconductor device, a second semiconductor device, and a third semiconductor device, wherein the first semiconductor device and the second semiconductor device are positioned on the first lead and the third semiconductor device is positioned on the second lead, wherein the first semiconductor device and the second semiconductor device are positioned adiacent to each other and widthwise along a width of the first lead proximal to a power input to reduce loop inductance of the first electronics package.
Dependencies are inferred from the claim text.