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US 11,638,353 B2Granted
Apparatus and method for forming sensors with integrated electrical circuits on a substrate
AssigneeHutchinson Technology Incorporated
InventorsMichael W. Davis, Jeffery G. Ribar, Clark T. Olsen
Life of this patent
Estimating the term…
Abstract
An apparatus is described. The apparatus includes a substrate and one or more sensor components formed on the substrate. And, the apparatus includes one or more electrical circuits formed on the substrate electrically coupled with at least one of the one or more sensor components formed on the substrate.
Claims10
An apparatus comprising:
- a substrate;
- one or more sensors formed in a first metal layer on the substrate;
- a first dielectric layer disposed between the substrate and the first metal layer, the first dielectric layer patterned such that the one or more sensors are disposed on the first dielectric layer;
- one or more electrical circuits formed on the substrate in a second metal layer separate from the one or more sensors and electrically coupled with at least one of the one or more sensors formed on the substrate using a via formed in the second metal layer;
- and
- a second dielectric layer disposed between the first metal layer and the second metal laver, wherein the second dielectric layer is patterned such that the one or more electrical circuits are disposed on the second dielectric laver, and wherein the via connects the one or more electrical circuits to the one or more sensors.
3 more elements
A method for forming a sensor with an integrated electrical circuit comprising:
- disposing a first dielectric layer over a substrate;
- etching the first dielectric layer to remove a portion of the first dielectric layer;
- disposing a first metal layer over the first dielectric layer;
- etching the first metal layer to form one or more sensors on the substrate, wherein the one or more sensors are disposed over a remaining portion of the first dielectric layer;
- forming one or more electrical circuits on the substrate in a second metal layer separate from the one or more sensors,
- forming at least one via in the second metal layer connecting the one or more sensors to the one or more electrical circuits;
- and
- disposing a second dielectric layer over the first metal layer;
- and
- etching the second dielectric layer to remove a portion of the second dielectric layer, wherein the one or more electrical circuits are disposed over a remaining portion of the second dielectric layer.
7 more elements
Dependencies are inferred from the claim text.