Component package and printed circuit board for the same

A printed circuit board, comprising:

• a substrate having a first surface and a second surface, opposing the first surface;
• a first wiring layer disposed on the first surface of the substrate;
• a second wiring layer disposed on the second surface of the substrate;
• a first passivation layer disposed on the first surface of the substrate and covering at least a portion of the first wiring layer;
• a second passivation layer disposed on the second surface of the substrate and covering at least a portion of the second wiring layer;
• a metal wall disposed on the first passivation layer and spatially partitioning at least two regions on a plane;
• an encapsulant disposed on the first passivation layer and having a groove portion exposing a portion of the metal wall;
• and
• a metal layer disposed on the encapsulant and extending to the metal wall,
• wherein the first wiring layer has a metal pad,
• the first passivation layer has an opening exposing a portion of the metal pad,
• the metal wall includes a lower portion disposed on the metal pad and in the opening of the first passivation layer, and an upper portion protruding from the lower portion of the metal wall, the lower portion of the metal wall and the upper portion of the metal wall being flush with an upper surface of the first passivation layer,
• the first and second passivation layers have a plurality of first and second openings exposing at least portions of the first and second wiring layers, respectively,
• a plurality of first and second electrical connection metals are disposed on the plurality of first and second openings and are connected to the exposed first and second wiring layers, respectively,
• in a region where the metal wall is in contact with the metal layer, a line width of the metal wall is greater than a line width of metal layer, and
• on the upper surface of the first passivation layer, a line width of the upper portion of the metal wall of the first passivation layer is less than a line width of the lower portion of the metal wall.

A component package, comprising:

• a substrate;
• a wiring layer including a metal pad extending from a first edge of the substrate to a second edge of the substrate;
• a passivation layer disposed on the substrate, and having an opening extending from the first edge of the substrate to the second edge of the substrate to expose the metal pad;
• a metal wall including a lower portion disposed in the opening of the passivation layer and an upper portion protruding from the lower portion to the passivation layer, the metal wall extending from the first edge of the substrate to the second edge of the substrate;
• a first electronic component disposed on one side of the metal wall and a second electronic component disposed on another side of the metal wall;
• and
• an encapsulant disposed on the passivation layer and encapsulating the first electronic component and the second electronic component, the encapsulant having a groove portion exposing a portion of the metal wall;
• and
• a metal layer covering an external surface of the encapsulant and a side surface of the substrate, and extending to the metal wall,
• wherein an inclined angle of a side surface of the lower portion with respect to the plane is less than an inclined angle of a side surface of the upper portion with respect to the plane,
• the lower portion of the metal wall and the upper portion of the metal wall are flush with an upper surface of the passivation layer, and
• on the upper surface of the passivation layer, a line width of the upper portion of the metal wall of the passivation layer is less than a line width of the lower portion of the metal wall.