Piezoelectric resonator device and system-in-package module including the same

A piezoelectric resonator device, comprising:

• a piezoelectric resonator plate including a first excitation electrode formed on a first main surface of a substrate, and a second excitation electrode formed on a second main surface of the substrate, the second excitation electrode making a pair with the first excitation electrode;
• a first sealing member covering the first excitation electrode of the piezoelectric resonator plate;
• a second sealing member covering the second excitation electrode of the piezoelectric resonator plate;
• and
• an internal space formed by bonding the first sealing member to the piezoelectric resonator plate and by bonding the second sealing member to the piezoelectric resonator plate, the internal space hermetically sealing a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate, wherein
• a mounting pad for wire bonding is formed on an outer surface of the first sealing member,
• an IC chip is mounted on the outer surface of the first sealing member, and
• a terminal on which the IC chip is mounted is formed on the outer surface of the first sealing member so as not to be superimposed on the first excitation electrode and the second excitation electrode.

A piezoelectric resonator device, comprising:

• a piezoelectric resonator plate including a first excitation electrode formed on a first main surface of a substrate, and a second excitation electrode formed on a second main surface of the substrate, the second excitation electrode making a pair with the first excitation electrode;
• a first sealing member covering the first excitation electrode of the piezoelectric resonator plate;
• a second sealing member covering the second excitation electrode of the piezoelectric resonator plate;
• and
• an internal space formed by bonding the first sealing member to the piezoelectric resonator plate and by bonding the second sealing member to the piezoelectric resonator plate, the internal space hermetically sealing a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate, wherein
• a mounting pad for wire bonding is formed on an outer surface of the first sealing member, and
• the mounting pad for wire bonding is disposed so as to face a frame body surrounding the internal space.