Surface acoustic wave device package and method of manufacturing the same

A method of manufacturing a surface acoustic wave device package using a first substrate, a second substrate disposed in parallel with the first substrate, and a plurality of surface acoustic wave devices disposed between the first substrate and the second substrate, the method comprising the steps of:

• primarily cutting, along a partitioning line, any one among the first substrate including the plurality of surface acoustic wave devices and the second substrate electrically connected to the first substrate;
• forming a protection member for wrapping a cut space of the cut substrate and a top of the cut substrate;
• flattening the protection member formed on the top of the cut substrate;
• and
• separating a plurality of surface acoustic wave device packages including package the surface acoustic wave device by secondarily cutting the substrate having the flattened protection member and an uncut substrate among the first and second substrates along a partitioning line,
• wherein the first substrate and the second substrate include a dam structure disposed on any one among the first substrate and the second substrate to connect the first substrate and the second substrate and wrap an electrode pattern, and the step of forming the protection member includes forming the protection member to wrap the dam structure.