Electronic component fixation structure and current detection device
AssigneeMitsubishi Electric Corporation
InventorMasahiro Noguchi
Life of this patent
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Abstract
An electronic component fixation structure disclosed in the present application includes a holding member which, being made of an insulating material, is formed of a storing portion which stores a main body portion of an electronic component, a protection portion which surrounds a plurality of connection terminals of the electronic component, and a pair of protrusion portions which protrude upward from the respective central portions of a pair of side walls of the protection portion; and a wiring substrate on which to connect between electronic components, wherein the pair of protrusion portions of the holding member are engaged with the wiring substrate, and the plurality of connection terminals of the electronic component are solder connected to the wiring substrate.
Claims19
An electronic component fixation structure in which to fix an electronic component which is formed of a main body portion with a semiconductor element resin sealed therein and a plurality of connection terminals which, being connected to the semiconductor element, are formed protruding from the main body portion, comprising:
- a holding member which, being made of an insulating material, is formed of a storing portion which stores the main body portion, a protection portion which surrounds the plurality of connection terminals, and a pair of protrusion portions which protrude upward from the respective central portions of a pair of side walls of the protection portion;
- a wiring substrate on which to connect between a plurality of electronic components;
- a power module which, being connected to the wiring substrate, generates power with which to drive a rotary electric machine;
- a conductor which supplies the rotary electric machine with the output from the power module;
- a core which, being provided adjacent to the conductor, is provided in one portion thereof a groove portion, wherein the main body portion of the semiconductor element is disposed in the groove portion;
- and
- a cooler which, having mounted thereon the power module, dissipates heat generated by the power module, wherein
- the conductor and the core are molded integrally with resin and fixed to the cooler, and wherein
- the pair of protrusion portions of the holding member are engaged with the wiring substrate, and the plurality of connection terminals of the semiconductor element are solder connected to the wiring substrate.
An electronic component fixation structure in which to fix an electronic component which is formed of a main body portion with a semiconductor element resin sealed therein and a plurality of connection terminals which, being connected to the semiconductor element, are formed protruding from the main body portion, comprising:
- a holding member which, being made of an insulating material, is formed of a storing portion which stores the main body portion, a protection portion which surrounds the plurality of connection terminals, and a pair of protrusion portions which protrude upward from the respective central portions of a pair of side walls of the protection portion;
- and a wiring substrate on which to connect between electronic components, wherein
- the pair of protrusion portions of the holding member are engaged with the wiring substrate, and the plurality of connection terminals of the semiconductor element are solder connected to the wiring substrate, and
- the protrusion portions of the holding member are configured by insert molding a steel plate in the holding member.
Dependencies are inferred from the claim text.