Electrical connector with high speed mounting interface

A substrate comprising a connector footprint, wherein the connector footprint comprises a plurality of regions disposed in rows and columns, each region comprising:

• a pair of signal vias, wherein signal vias of the pair are separated from one another along a first direction;
• a pair of conductive pads, wherein conductive pads of the pair are separated from one another along a second direction that is orthogonal to the first direction;
• and
• conductive traces interconnecting respective ones of the signal vias and conductive pads.

An electronic assembly comprising:

• a substrate comprising a plurality of conductive pads on a surface of the substrate and a plurality of vias, wherein the conductive pads are connected to signal traces within the substrate and the vias are connected to ground structures within the substrate;
• and
• a connector mounted to the substrate, wherein:
• the connector comprises a plurality of signal conductors and a plurality of shielding members at least partially surrounding subsets of the plurality of signal conductors;
• the signal conductors comprise contact tails comprising broad sides and edges and the edges are facing and connected to respective ones of the plurality of conductive pads;
• the plurality of shielding members comprise contact tails inserted within respective vias of the plurality of vias.