Antenna packaged substrate and manufacturing method thereof, packaged antenna, and terminal

A packaged antenna, comprising:

• a radio frequency integrated circuit;
• a substrate;
• a first antenna radiating patch disposed on a surface of the substrate;
• a second antenna radiating patch disposed over the first antenna radiating patch;
• and
• a dielectric stack disposed between the first antenna radiating patch and the second antenna radiating patch, wherein the dielectric stack comprises a first dielectric layer, a bonding layer disposed on a side of the first dielectric layer that faces the first antenna radiating patch, and a second dielectric layer disposed on a side of the first dielectric layer that faces the second antenna radiating patch, wherein
• a dielectric constant of the first dielectric layer is lower than a dielectric constant of the substrate, an expansion coefficient of the second dielectric layer is lower than an expansion coefficient of the first dielectric layer, and the radio frequency integrated circuit is mounted on a side that is opposite to a side on which the second antenna radiating patch is located.

A terminal, comprising:

• a circuit board, wherein the terminal further comprises a packaged antenna mounted on the circuit board, the packaged antenna comprising:
• a radio frequency integrated circuit;
• a substrate;
• a first antenna radiating patch disposed on a surface of the substrate;
• a second antenna radiating patch disposed over the first antenna radiating patch;
• and
• a dielectric stack disposed between the first antenna radiating patch and the second antenna radiating patch, wherein the dielectric stack comprises a first dielectric layer, a bonding layer disposed on a side of the first dielectric layer that faces the first antenna radiating patch, and a second dielectric layer disposed on a side of the first dielectric layer that faces the second antenna radiating patch, wherein
• a dielectric constant of the first dielectric layer is lower than a dielectric constant of the substrate, an expansion coefficient of the second dielectric layer is lower than an expansion coefficient of the first dielectric layer, and the radio frequency integrated circuit is mounted on a side that is opposite to a side on which the second antenna radiating patch is located and faces the circuit board.

A method of manufacturing an antenna packaged substrate, comprising:

• providing a substrate, and manufacturing a first antenna radiating patch on a surface of the substrate;
• forming a dielectric stack on the first antenna radiating patch, wherein in a direction perpendicular to and gradually away from the substrate, the dielectric stack comprises a bonding layer, a first dielectric layer, and a second dielectric layer, wherein a dielectric constant of the first dielectric layer is lower than a dielectric constant of the substrate, and an expansion coefficient of the second dielectric layer is lower than an expansion coefficient of the first dielectric layer;
• and
• manufacturing a second antenna radiating patch on a surface that is of the dielectric stack and faces away from the substrate.