Antenna module
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJae Yeong Kim, Sung Yong An, Chang Hak Choi
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Abstract
An antenna module includes a substrate having a first surface including a ground region and a feeder region; chip antennas mounted on the first surface of the substrate; and at least one patch antenna disposed inside of the substrate or at least partially disposed on a second surface of the substrate. The chip antennas include a body portion, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion. The ground portion of each chip antenna is mounted on the ground region and the radiation portion of each chip antenna is mounted on the feeder region.
Claims20
An antenna module comprising:
- a substrate having a first surface including a ground region in which a ground layer is disposed and a feeder region disposed outside the ground region;
- chip antennas mounted on the first surface of the substrate;
- and
- wherein each of the chip antennas include a body portion that extends lengthwise in a direction corresponding to a first edge of the substrate, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion,
- wherein the ground portion of each of the chip antennas is mounted on the ground region and the radiation portion of each of the chip antennas is mounted on the feeder region such that the radiation portion is disposed closer to the first edge of the substrate than the ground portion, and
- wherein the substrate includes ground pads disposed in the ground region, each of the ground pads being bonded the ground portion of the respective chip antenna and electrically connected to the ground layer.
Dependencies are inferred from the claim text.