Display device and manufacturing method therefor

A method for manufacturing a display device,

• the display device including
• a base substrate,
• a plurality of switching elements disposed on the base substrate,
• a flattening film disposed on the plurality of switching elements,
• a light-emitting element disposed on the flattening film,
• a sealing film disposed over the light-emitting element, the sealing film comprising a stack of, in sequence, a first inorganic film, an organic film, and a second inorganic film, and
• a display region and a frame region disposed around the display region,
• the method comprising at least:
• forming a recess in the flattening film when forming the flattening film so as to cover the plurality of switching elements disposed on the base substrate;
• forming a plurality of mask spacers onto the flattening film, in the frame region disposed more remotely from the display region than the recess is;
• forming the first inorganic film onto a surface of the recess and surfaces of the plurality of mask spacers;
• and
• ejecting, through ink jetting, an organic resin material all over a surface of the base substrate provided with the first inorganic film, to form the organic film onto a surface of the first inorganic film and to fill the recess with the organic resin material, wherein
• the filling comprises
• when an inkjet passes through the recess, changing an ejection timing in such a manner that the organic resin material lands in the recess,
• the ejection timing is defined by an application frequency f expressed by Expression 1 as follows, and
• the ejection timing equals 1/f in a normal region except a region where the recess is located, and the ejection timing is shorter than 1/f in the region where the recess is located:
• [Expression 1]
• f=pvt/(nV) (1),
• where p denotes a nozzle pitch in the ink jetting, where V denotes an ejection volume per drop, where v denotes a scanning rate in the ink jetting, where n denotes a number of scanning times in the ink jetting, which is a number of times of dropping into an application region, where t denotes a desired thickness of the organic film.