Optically clear thermal spreader for status indication within an electronics package

A system comprising:

• an electronic package comprising:
• a package base couplable to a host substrate;
• a package lid mechanically coupled to the package base comprising one or more transparent lid areas, wherein the one or more transparent lid areas are configured to allow transmission of light through the package lid;
• a thermal spreader bonded on a first side to a first side of the package lid, comprising one or more transparent spreader areas, wherein the one or more transparent spreader areas are configured to allow transmission of the light through the thermal spreader;
• one or more integrated circuits bonded to a second side of the thermal spreader, wherein the one or more integrated circuits is communicatively coupled to the host substrate;
• optical paths comprising at least one of the one or more transparent spreader areas configured adjacent to at least one of the one or more transparent lid areas;
• and
• one or more light sources disposed within the electronic package and electrically coupled to at least one of the one or more integrated circuits,
• wherein the one or more transparent lid areas are arranged in a grid,
• wherein the one or more light sources are coupled to a portion of the one or more transparent lid areas, wherein the portion of the transparent lid areas define a pattern uniquely identifying the electronic package, wherein the light is transmitted to the portion of the transparent lid areas via at least a portion of the optical paths, wherein the light is detectable outside of the electronic package,
• wherein the optical paths comprise light transmissible materials configured to modify one or more characteristics of the light transmitting through the optical paths, wherein a resultant modification of the one or more characteristics of the light transmitting through the optical paths is configured to uniquely identify the electronic package.