Back to results
US 11,637,171 B2Granted
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
AssigneeIntel Corporation
InventorsShivasubramanian Balasubramanian, Dilan Seneviratne
Life of this patent
Estimating the term…
Abstract
A semiconductor package substrate includes an integral magnetic-helical inductor that is assembled during assembly of the semiconductor package substrate. The integral magnetic-helical inductor is located within a die footprint within the semiconductor package substrate.
Claims16
A semiconductor package substrate, comprising:
- a first build-up film including a first surface;
- a bottom rail abutting the first build-up film opposite the first surface;
- a bottom pillar contacting the bottom rail and penetrating the first build-up film;
- a top bond pad contacting the bottom pillar and abutting the first surface;
- a top pillar contacting the top bond pad and including a hemi-loop that is integral with the top pillar,
- a peripheral magnetic body that contacts the top pillar, the hemi-loop and the top bond pad;
- and
- a subsequent and adjacent build-up film that contacts the first build-up film, the top pillar, the peripheral magnetic body, the hemi-loop and the top bond pad.
5 more elements
A semiconductor package substrate, comprising:
- a plurality of layers, including conductor traces and dielectric build up material;
- a hemi-loop structure coupled to one or more of the conductor traces;
- and
- a peripheral magnetic body laterally covering the hemi-loop structure.
1 more element
A semiconductor package substrate, comprising:
- a plurality of layers, including conductor traces and dielectric build up material;
- a plurality of hemi-loop structures coupled to one or more of the conductor traces;
- and
- a peripheral magnetic body laterally covering the plurality of hemi-loop structures.
1 more element
Dependencies are inferred from the claim text.