Tilted transfer gate for advanced CMOS image sensor
AssigneeOmniVision Technologies, Inc.
InventorQin Wang
Life of this patent
Estimating the term…
Loading patent…
AssigneeOmniVision Technologies, Inc.
InventorQin Wang
Estimating the term…
A pixel circuit includes a trench etched into a front side surface of a semiconductor substrate. The trench includes a bottom surface etched along a <100> crystalline plane and a tilted side surface etched along a <111> crystalline plane that extends between the bottom surface and the front side surface. A floating diffusion is disposed in the semiconductor substrate beneath the bottom surface of the trench. A photodiode is disposed in the semiconductor substrate beneath the tilted side surface of the trench and is separated from the floating diffusion. The photodiode is configured to photogenerate image charge in response to incident light. A tilted transfer gate is disposed over at least a portion of the bottom surface and at least a portion of the tilted side surface of the trench. The tilted transfer gate is configured to transfer the image charge from the photodiode to the floating diffusion.
A pixel circuit, comprising:
Dependencies are inferred from the claim text.