Display substrate and method for forming the same and display device

A method for forming a display substrate, comprising:

• forming a first conductive pattern on a base substrate;
• forming a ring-shaped conductive protection structure at an edge of a preset region of the first conductive pattern and surrounding the preset region, wherein the conductive protection structure is made of an anti-dry-etching material;
• forming an insulation layer covering the first conductive pattern;
• performing a dry-etching on the insulation layer to form a via-hole penetrating the insulation layer, wherein an orthographic projection of the via-hole onto the base substrate is surrounded by an orthographic projection of the conductive protection structure onto the base substrate, and the orthographic projection of the via-hole onto the base substrate partially overlaps the orthographic projection of the conductive protection structure onto the base substrate;
• and
• forming a second conductive pattern on the insulation layer, wherein the second conductive pattern is electrically connected to the first conductive pattern through the via-hole,
• wherein the forming the first conductive pattern on the base substrate comprises:
• forming a ring-shaped protrusion surrounding the preset region on a surface of the first conductive pattern facing the insulation layer;
• the forming the conductive protection structure comprises:
• forming the conductive protection structure covering the protrusion.

A method for forming a display substrate, comprising:

• forming a first conductive pattern on a base substrate;
• forming a ring-shaped conductive protection structure at an edge of a preset region of the first conductive pattern and surrounding the preset region, wherein the conductive protection structure is made of an anti-dry-etching material;
• forming an insulation layer covering the first conductive pattern;
• performing a dry-etching on the insulation layer to form a via-hole penetrating the insulation layer, wherein an orthographic projection of the via-hole onto the base substrate is surrounded by an orthographic projection of the conductive protection structure onto the base substrate, and the orthographic projection of the via-hole onto the base substrate partially overlaps the orthographic projection of the conductive protection structure onto the base substrate;
• and
• forming a second conductive pattern on the insulation layer, wherein the second conductive pattern is electrically connected to the first conductive pattern through the via-hole,
• wherein the first conductive pattern further comprises a ring-shaped protrusion surrounding the preset region, and the conductive protection structure is configured to cover the protrusion.