Method of manufacturing package structure

A method of manufacturing a package structure, comprising:

• forming a backside RDL structure on a carrier;
• mounting a plurality of first passive devices on the backside RDL structure;
• forming a plurality of through insulator vias (TIVs) on the backside RDL structure;
• placing a die on the backside RDL structure, so that the die is laterally disposed between the plurality of first passive devices;
• forming an encapsulant laterally encapsulating the die, the plurality of TIVs, and the plurality of first passive devices;
• forming a front side RDL structure on a front side of the die, the plurality of TIVs, and the encapsulant;
• releasing the backside RDL structure from the carrier;
• and
• mounting a package on the backside RDL structure, wherein the package is electrically connected to the plurality of first passive devices by a plurality of conductive connectors and a plurality of solders.

A method of manufacturing a package structure, comprising:

• forming a backside RDL structure on a carrier;
• forming a plurality of through insulator vias (TIVs) on the backside RDL structure;
• placing a die and a plurality of passive devices on the backside RDL structure, so that the plurality of passive devices are laterally disposed between the plurality of TIVs, and the die and is laterally disposed between the plurality of passive devices;
• forming an encapsulant laterally encapsulating the die, the plurality of TIVs, and the plurality of passive devices;
• forming a front side RDL structure on a front side of the die, the plurality of TIVs, the plurality of passive devices, and the encapsulant;
• releasing the backside RDL structure from the carrier;
• and
• mounting a package on the backside RDL structure, wherein the package is electrically connected to the plurality of passive devices by a plurality of conductive connectors.