Micro light-emitting diode display fabrication and assembly

A method of manufacturing a micro-light emitting diode (LED) display panel, the method comprising:

• positioning a glass carrier substrate above a display backplane substrate, the glass carrier substrate having a plurality of light-emitting diode (LED) pixel elements attached to an adhesive layer thereon, and the display backplane substrate having a plurality of metal bumps thereon, each of the LED pixel elements comprising a blue color nanowire LED on a first nucleation layer above a silicon (111) substrate, the blue color nanowire LED comprising a first GaN core, a green color nanowire LED above a second nucleation layer above the silicon (111) substrate, the green color nanowire LED comprising a second GaN core, and a red color nanowire LED above a third nucleation layer above the silicon (111) substrate, the red color nanowire LED comprising a GaInP core;
• aligning the glass carrier substrate with the display backplane substrate;
• moving the display backplane substrate and the glass carrier substrate together to couple at least a portion of the plurality of LED pixel elements to corresponding ones of the plurality of metal bumps, wherein moving the display backplane substrate and the glass carrier substrate together comprises moving the display backplane substrate from a first position to a second position while the glass carrier substrate remains in a fixed position, the second position different than the first position;
• irradiating the adhesive layer through the glass carrier substrate with a UV light source to release and transfer the portion of the plurality of LED pixel elements to the corresponding ones of the plurality of metal bumps;
• and, subsequently,
• separating the glass carrier substrate from the display backplane substrate.