Multi-chip device and method of formation
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChin-Hua Wang, Po-Chen Lai, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng
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Abstract
A multi-chip device includes a first material within a substrate. The first material has a first coefficient of thermal expansion different than a second coefficient of thermal expansion of the substrate. A first chip overlies a first portion of the first material and a first portion of the substrate. A second chip overlies a second portion of the first material and a second portion of the substrate. The first material is between the first portion of the substrate and the second portion of the substrate.
Claims20
A multi-chip device, comprising:
- a first material within a substrate, wherein the first material has a first coefficient of thermal expansion different than a second coefficient of thermal expansion of the substrate;
- a first chip overlying a first portion of the first material and a first portion of the substrate;
- and
- a second chip overlying a second portion of the first material and a second portion of the substrate, wherein:
- the first material is between the first portion of the substrate and the second portion of the substrate.
A semiconductor packaging structure to electrically couple a first chip to a second chip, comprising:
- a first material embedded within a substrate, wherein the first material is different than a second material of the substrate;
- and
- a redistribution layer overlying the substrate, wherein:
- a first surface of the first chip and a second surface of the second chip are separated by a gap,
- the gap overlies the first material,
- a first portion of the first material and a first portion of the substrate underlie the first chip,
- a second portion of the first material and a second portion of the substrate underlie the second chip, and
- the redistribution layer is electrically coupled to the first chip and the second chip.
A method to form a multi-chip device, comprising:
- forming an opening in a substrate;
- filling the opening with a first material, wherein the first material is different than a second material of the substrate;
- mounting a first chip over the substrate;
- and
- mounting a second chip over the substrate, wherein:
- the first material underlies a gap between the first chip and the second chip, and
- a width of the gap is less than a width of the first material.
Dependencies are inferred from the claim text.