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US 11,637,086 B2Granted
Sawing underfill in packaging processes
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSzu-Wei Lu, Ying-Da Wang, Li-Chung Kuo, Jing-Cheng Lin
Life of this patent
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Abstract
A method includes bonding a first and a second package component on a top surface of a third package component, and dispensing a polymer. The polymer includes a first portion in a space between the first and the third package components, a second portion in a space between the second and the third package components, and a third portion in a gap between the first and the second package components. A curing step is then performed on the polymer. After the curing step, the third portion of the polymer is sawed to form a trench between the first and the second package components.
Claims20
A package comprising:
- a substrate;
- a first die over the substrate;
- a conductive feature between and bonding the substrate and the first die;
- a second die over the substrate;
- and
- an encapsulant comprising:
- a first portion on a sidewall of the first die;
- a second portion on a sidewall of the second die, wherein the first portion and the second portion are directly over the substrate;
- and
- a third portion connecting the first portion to the second portion to form a continuous part of the encapsulant, wherein the encapsulant is free from interfaces between the first portion and the third portion, and between the second portion and the third portion, and wherein the third portion further extends directly underlying the first die and the second die, and is in physical contact with the conductive feature;
- and
- a molding compound comprising a first part between the first portion and the second portion of the encapsulant, wherein the first part of the molding compound is further between the first die and the second die, and is directly over the substrate and the third portion of the encapsulant, wherein a first top surface of the first part of the molding compound, second top surfaces of the first portion and the second portion of the encapsulant, and third top surfaces of the first die and the second die share a common plane with each other, and wherein the molding compound forms a U-shaped interface with the encapsulant, and wherein the U-shape interface has two vertical portions parallel to each other, and a bottom portion interconnecting the two vertical portions, and wherein top ends of the two vertical portions are at a same level as top surfaces of the first die, the second die, and the molding compound.
9 more elements
A package comprising:
- a package component;
- a first device die over and bonding to the package component;
- a second device die over and bonding to the package component;
- a first encapsulant comprising an underfill that comprises a polymer, wherein the first encapsulant comprises:
- a first portion between the first device die and the second device die, wherein the first portion comprises a first vertical sidewall and a second vertical sidewall opposite to each other, and wherein the first vertical sidewall contacts the first device die;
- a second portion between the first device die and the second device die, wherein the second portion comprises a third vertical sidewall and a fourth vertical sidewall opposite to each other, and wherein the fourth vertical sidewall contacts the second device die;
- and
- a third portion overlapped by entireties of each of the first device die and the second device die, wherein the first portion, the second portion, and the third portion are continuously interconnected as a continuous region, with no interface between the first portion and the third portion, and between the second portion and the third portion;
- and
- a second encapsulant between the first portion and the second portion, with the third portion directly underlying the second encapsulant, wherein the second encapsulant comprises a molding compound in direct contact with the first portion and the second portion of the first encapsulant, wherein top surfaces of the first encapsulant, the second encapsulant, the first device die, and the second device die are coplanar.
7 more elements
A package comprising:
- a first device die comprising a first edge and a second edge opposite to each other;
- a second device die comprising a third edge and a fourth edge opposite to each other;
- a first encapsulant comprising an underfill, the first encapsulant further comprising:
- a first portion comprising a first sidewall contacting the first device die, and a second sidewall opposite to, and parallel to, the first sidewall;
- a second portion comprising a third sidewall contacting the second device die, and a fourth sidewall opposite to, and parallel to, the third sidewall;
- and
- a third portion continuously connected to the first portion and the second portion, wherein the third portion laterally extends from the first edge to the second edge of the first device die, and laterally extends from the third edge to the fourth edge of the second device die, and wherein the first portion, the second portion, and the third portion are continuously interconnected as a continuous region, with no interface between the first portion and the third portion, and between the second portion and the third portion;
- and
- a second encapsulant comprising a portion between and contacting the first portion and the second portion of the first encapsulant, wherein top surfaces of the first encapsulant and the second encapsulant are coplanar, and the portion of the second encapsulant overlaps the third portion of the first encapsulant, and wherein the second encapsulant comprises a molding compound in direct contact with the first portion and the second portion of the first encapsulant.
6 more elements
Dependencies are inferred from the claim text.