Semiconductor package and method for fabricating the same

A semiconductor package comprising:

• a controller which transmits a control signal including a first channel signal and a second channel signal;
• a first nonvolatile memory package which receives the first channel signal, and a second nonvolatile memory package which receives the second channel signal;
• and
• a diverging chip,
• wherein the first nonvolatile memory package and the second nonvolatile memory package are located on a single substrate, and the first channel signal and the second channel signal are diverged from the control signal in the substrate, and
• wherein the diverging chip located inside the single substrate and the diverging chip receives the control signal and diverges the received control signal into the first channel signal and the second channel signal.

A semiconductor package comprising:

• a substrate;
• a first buffer pad and a second buffer pad located on an upper part of the substrate;
• a first buffer chip and a second buffer chip electrically connected to each of the first buffer pad and the second buffer pad;
• a plurality of nonvolatile memory chips located on the upper part of the substrate and including a first nonvolatile memory chip and a second nonvolatile memory chip, the first nonvolatile memory chip being electrically connected to the first buffer chip, and the second nonvolatile memory chip being electrically connected to the second buffer chip;
• a plurality of external connection terminals connected to a lower part of the substrate;
• a controller which transmits a control signal including a first channel signal and a second channel signal to one of the plurality of external connection terminals;
• and
• a single rewiring pattern which is located inside the substrate, wherein the single rewiring pattern is connected to the first buffer chip, the second buffer chip, and one external connection terminal among the plurality of external connections terminals to diverge the control signal received from the one external connection terminal into the first and second channel signals, transmit the first channel signal to the first buffer chip, and transmit the second channel signal to the second buffer chip.