Uniform pressure gang bonding method

A uniform pressure gang bonding method comprising:

• providing a lower plate and an expandable upper chamber with an elastic surface;
• depositing a plurality of components overlying a substrate top surface;
• positioning the substrate overlying the lower plate, with the substrate top surface underlying and adjacent to the elastic surface, and occupying an environmental control lower chamber with a seal formed by the elastic surface of the expandable upper chamber;
• creating a positive upper chamber medium pressure differential in the expandable upper chamber greater than the pressure in the environmental control lower chamber;
• temporarily deforming the elastic surface in a direction towards the substrate top surface;
• and,
• in response to temporarily deforming the elastic surface, applying a uniform pressure on the plurality of components.

A uniform pressure gang bonding method comprising:

• providing a lower plate and an expandable upper chamber with an elastic surface;
• depositing a plurality of components overlying a substrate top surface;
• positioning the substrate overlying the lower plate, with the substrate top surface underlying and adjacent to the elastic surface;
• creating a positive upper chamber medium pressure differential in the expandable upper chamber;
• temporarily deforming the elastic surface;
• in response to temporarily deforming the elastic surface, applying a uniform pressure on the plurality of components;
• simultaneous with applying the uniform pressure, heating the substrate;
• subsequent to temporarily deforming the elastic surface a first time and bonding a first group of components to a first substrate top surface, depositing a second group of components overlying a second substrate top surface;
• positioning the second substrate overlying the lower plate, with the second substrate top surface underlying and adjacent to the elastic surface;
• creating a positive upper chamber medium pressure differential in the expandable upper chamber;
• temporarily deforming the elastic surface a second time;
• and,
• in response to deforming the elastic surface the second time, applying a uniform pressure on the second group of components.

A uniform pressure gang bonding method comprising:

• providing a lower plate and an expandable upper chamber with an elastic surface;
• depositing a plurality of components overlying a substrate top surface;
• positioning the substrate overlying the lower plate, with the substrate top surface underlying and adjacent to the elastic surface, and occupying an environmental control lower chamber with an atmospheric pressure controlled by a type of gas medium selected from the group consisting of ambient air, an inert gas, a forming gas, formic acid, and combinations thereof, and an environmental control lower chamber atmospheric pressure controlled by a forming gas medium followed by an inert gas medium;
• creating a positive upper chamber medium pressure differential in the expandable upper chamber;
• temporarily deforming the elastic surface in a direction towards the substrate top surface;
• and,
• in response to temporarily deforming the elastic surface, applying a uniform pressure on the plurality of components.

A uniform pressure gang bonding method comprising:

• providing a lower plate and an expandable upper chamber with an elastic surface;
• depositing a plurality of components overlying a substrate top surface;
• positioning the substrate overlying the lower plate, with the substrate top surface underlying and adjacent to the elastic surface, and occupying an environmental control lower chamber with a seal formed by the elastic surface of the expandable upper chamber;
• creating a positive upper chamber medium pressure differential in the expandable upper chamber greater than the pressure in the environmental control lower chamber;
• deforming the elastic surface in a direction towards the substrate top surface;
• in response to deforming the elastic surface, applying a uniform pressure on the plurality of components;
• and,
• repeating the steps required for bonding a second group of components.

A uniform pressure gang bonding method comprising:

• providing a lower plate and an expandable upper chamber with an elastic surface;
• depositing a plurality of components overlying a substrate top surface;
• positioning the substrate overlying the lower plate, with the substrate top surface underlying and adjacent to the elastic surface;
• creating a positive upper chamber medium pressure differential in the expandable upper chamber;
• in response to temporarily deforming the elastic surface, applying a uniform pressure on the plurality of components;
• simultaneous with applying the uniform pressure, heating the substrate;
• bonding the components to the substrate top surface in response to the uniform pressure and heat;
• decreasing the upper chamber medium pressure differential in the expandable upper chamber;
• separating the elastic surface from the components on the substrate top surface;
• subsequent to temporarily deforming the elastic surface a first time and bonding a first group of components to a first substrate top surface, depositing a second group of components overlying a second substrate top surface;
• positioning the second substrate overlying the lower plate, with the second substrate top surface underlying and adjacent to the elastic surface;
• creating a positive upper chamber medium pressure differential in the expandable upper chamber;
• temporarily deforming the elastic surface a second time;
• and,
• in response to deforming the elastic surface the second time, applying a uniform pressure on the second group of components.

A uniform pressure gang bonding method comprising:

• providing a lower plate and an expandable upper chamber with an elastic surface;
• depositing a plurality of components overlying a substrate top surface;
• positioning the substrate overlying the lower plate, with the substrate top surface underlying and adjacent to the elastic surface, occupying an environmental control lower chamber with an atmospheric pressure controlled by a forming gas medium followed by an inert gas medium;
• creating a positive upper chamber medium pressure differential in the expandable upper chamber;
• temporarily deforming the elastic surface;
• in response to temporarily deforming the elastic surface, applying a uniform pressure on the plurality of components;
• in response to the uniform pressure, bonding the components to the substrate top surface;
• decreasing the upper chamber medium pressure differential in the expandable upper chamber;
• and,
• separating the elastic surface from the components on the substrate top surface.