Semiconductor package including antenna

A semiconductor package comprising:

• a supporting wiring structure including a redistribution dielectric layer and a redistribution conductive structure;
• an expansion layer including a frame on the supporting wiring structure, a dielectric filling member, and a connection structure, the frame having a mounting space and a through hole and being grounded through the redistribution conductive structure, the dielectric filling member filling the mounting space and the through hole and surrounding the frame, and the connection structure extending in the through hole and being electrically connected to the redistribution conductive structure;
• a semiconductor chip in the mounting space and including a radio-frequency integrated circuit (RFIC) electrically connected to the redistribution conductive structure;
• and
• an antenna part on the expansion layer, the antenna part exchanging signals with the semiconductor chip through the connection structure,
• wherein the connection structure, a portion of the frame adjacent to the through hole, and a portion of the dielectric filling member form a signal transmission line having a coaxial structure, the portion of the dielectric filling member being between the connection structure in the through hole and the frame and surrounding the connection structure in a ring shape.

A semiconductor package comprising:

• a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure;
• an expansion layer including a frame on the supporting wiring structure, a dielectric filling member, and a plurality of connection structures, the frame having a mounting space and a plurality of through holes and including a conductive material grounded through the first redistribution conductive structure, the dielectric filling member filling the mounting space and the plurality of through holes and surrounding the frame, and the plurality of connection structures respectively extending in the plurality of through holes and including a material having a higher electrical conductivity than the frame;
• a semiconductor chip in the mounting space and including a radio-frequency integrated circuit (RFIC) electrically connected to the first redistribution conductive structure;
• a cover wiring structure on the expansion layer and including a second redistribution dielectric layer and a second redistribution conductive structure;
• and
• an antenna structure on the cover wiring structure and forming a patch antenna together with at least a portion of the cover wiring structure,
• wherein the plurality of connection structures are electrically connected to the first redistribution conductive structure and the second redistribution conductive structure and transmit a signal between the patch antenna and the semiconductor chip, and
• wherein each of the plurality of connection structures, a portion of the frame adjacent to each of the plurality of through holes, and a portion of the dielectric filling member form a signal transmission line having a coaxial structure, the portion of the dielectric filling member being between each of the plurality of connection structures in a corresponding one of the plurality of through holes and the frame and surrounding each of the plurality of connection structures in a ring shape.