Method of processing wafer
AssigneeDisco Corporation
InventorKarl Heinz Priewasser
Life of this patent
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Abstract
A wafer having on one side a device area with a plurality of devices is processed by providing a protective film and applying the protective film, for covering the devices on the wafer, to the one side of the wafer, so that a front surface of the protective film is in direct contact with the one side of the wafer. The protective film is heated during and/or after applying the protective film to the one side of the wafer, so that the protective film is attached to the one side of the wafer, and the side of the wafer opposite to the one side is processed. Further, the invention relates to a method of processing such a wafer in which a liquid adhesive is dispensed only onto a peripheral portion of a protective film and/or only onto a peripheral portion of the wafer.
Claims27
A method of processing a wafer, having on one side a device area with a plurality of devices, wherein the method comprises:
- providing a solid protective film;
- applying the solid protective film, for covering the devices on the wafer, to the one side of the wafer, so that a front surface of the solid protective film is in direct contact with the one side of the wafer, such that no adhesive is present between the front surface of the solid protective film and the one side of the wafer;
- heating the solid protective film during and/or after applying the solid protective film to the one side of the wafer, so that the solid protective film is attached to the one side of the wafer;
- and
- removing the solid protective film from the wafer.
A solid protective film for use in a method of processing a wafer, the wafer having on one side a device area with a plurality of devices, wherein:
- the solid protective film has no adhesive so that the solid protective film is configured to be applied to the one side of the wafer in direct contact with the one side of the wafer;
- the solid protective film is configured so as to be softened by heating the solid protective film;
- the solid protective film is configured to be attached to the wafer, wherein an attachment force between the solid protective film and the wafer, attaching the solid protective film to the one side of the wafer, is generated through heating the solid protective film;
- and
- the solid protective film is configured as a material which is sufficiently flexible to allow the solid protective film to be removed from the wafer by peeling off the solid protective film from the wafer.
A wafer with a solid protective film, the wafer having on one side a device area with a plurality of devices, wherein:
- the solid protective film has no adhesive so that the solid protective film is applied to the one side of the wafer in direct contact with the one side of the wafer;
- the solid protective film is configured so as to be softened by heating the solid protective film;
- the solid protective film is attached to the wafer, wherein an attachment force between the solid protective film and the wafer, attaching the solid protective film to the one side of the wafer, is generated through heating the solid protective film;
- and
- the solid protective film is configured as a material which is sufficiently flexible to allow the solid protective film to be removed from the wafer by peeling off the solid protective film from the wafer.
Dependencies are inferred from the claim text.