Back to results
US 11,637,073 B2Granted
Semiconductor package with EMI shield and fabricating method thereof
AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorsDoo Soub Shin, Tae Yong Lee, Kyoung Yeon Lee, Sung Gyu Kim
Life of this patent
Estimating the term…
Abstract
A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.
Claims17
An apparatus, comprising:
- a substrate comprising conductive traces, a substrate top side, a substrate bottom side, and substrate sidewalls between the substrate top side and the substrate bottom side;
- a first semiconductor device coupled to a first conductive trace of the conductive traces via the substrate top side;
- a first encapsulant that encapsulates the first semiconductor device, the first encapsulant comprising a first encapsulant top side, a first encapsulant bottom side, and first encapsulant sidewalls between the first encapsulant top side and the first encapsulant bottom side;
- an electromagnetic interference (EMI) shield comprising:
- an EMI shield top portion that covers the first encapsulant top side;
- an EMI shield bottom portion that covers the substrate bottom side;
- and
- EMI shield sidewall portions that cover the first encapsulant sidewalls and the substrate sidewalls;
- an electrical interconnect on the substrate bottom side, wherein the electrical interconnect is exposed from the EMI shield bottom portion and is coupled to a second conductive trace of the conductive traces via the substrate bottom side;
- and
- a ground interconnect, wherein the ground interconnect extends through the EMI shield bottom portion, wherein the ground interconnect is coupled to a ground portion of the conductive traces, and wherein the ground interconnect contacts the EMI shield bottom portion as the ground interconnect passes through EMI shield bottom portion;
- and
- wherein the electrical interconnect passes through the EMI shield bottom portion without contacting the EMI shield bottom portion.
10 more elements
An apparatus, comprising:
- a substrate comprising a substrate top side, a substrate bottom side, and substrate sidewalls between the substrate top side and the substrate bottom side;
- a first semiconductor device coupled to the substrate top side;
- a first encapsulant comprising a first encapsulant top side, a first encapsulant bottom side, and first encapsulant sidewalls between the first encapsulant top side and the first encapsulant bottom side, wherein the first encapsulant encapsulates the first semiconductor device and the substrate top side;
- an electromagnetic interference (EMI) shield covering the first encapsulant top side, the first encapsulant sidewalls, the substrate sidewalls, and the substrate bottom side;
- and
- interconnects that extend through the EMI shield and couple to the substrate bottom side;
- wherein the interconnects include electrical interconnects and one or more ground interconnects;
- wherein each ground interconnect extends through a respective ground interconnect opening in the EMI shield and contacts the EMI shield at its respective ground interconnect opening;
- and
- wherein each electrical interconnect extends through a respective electrical interconnect opening in the EMI shield.
7 more elements
A method, comprising:
- coupling a first semiconductor device to a substrate top side of a substrate, wherein the substrate comprises the substrate top side, a substrate bottom side, and substrate sidewalls between the substrate top side and the substrate bottom side;
- encapsulating the first semiconductor device in a first encapsulant, wherein the first encapsulant comprises a first encapsulant top side, a first encapsulant bottom side, and first encapsulant sidewalls between the first encapsulant top side and the first encapsulant bottom side;
- covering the first encapsulant top side, the first encapsulant sidewalls, and the substrate sidewalls with an electromagnetic interference (EMI) shielding material to form a first EMI shield portion that covers the first encapsulant top side, the first encapsulant sidewalls, and the substrate sidewalls;
- covering the substrate bottom side with the EMI shielding material to form a second EMI shield portion that covers the substrate bottom side and contacts the first EMI shield portion;
- and
- providing interconnects that extend through the second EMI shield portion and couple to the substrate bottom side;
- wherein the interconnects include electrical interconnects and one or more ground interconnects;
- wherein each ground interconnect extends through a respective ground interconnect opening in the EMI shield and contacts the EMI shield at its respective ground interconnect opening;
- and
- wherein each electrical interconnect extends through a respective electrical interconnect opening in the EMI shield.
7 more elements
Dependencies are inferred from the claim text.