Semiconductor package and method of manufacturing the same

A semiconductor package, comprising:

• a substrate;
• a semiconductor die, disposed on the substrate in an offset position toward an edge of the substrate;
• and
• an electromagnetic interference shielding structure, disposed on and electrically connected to the substrate, wherein the semiconductor die is located in a space confined by the substrate and the electromagnetic interference shielding structure, and a recess formed in the electromagnetic interference shielding structure corresponds to the offset position, wherein a sidewall of the recess is aligned with a sidewall of the semiconductor die, and the sidewall of the recess is connected to and surrounds a perimeter of a top surface of the recess.

A method of manufacturing a semiconductor package, comprising:

• providing a semiconductor die;
• mounting the semiconductor die to a substrate;
• adhering a ring structure on the substrate to surround the semiconductor die, a first side of the semiconductor die being distant from an inner sidewall of the ring structure by a first gap, and a second side of the semiconductor die being distant from the inner sidewall of the ring structure by a second gap, wherein the first side is opposite to the second side, and the first gap is less than the second gap;
• and
• adhering a lid on the ring structure to form an accommodating space with the ring structure and the substrate, the semiconductor die being located in the accommodating space, and the lid comprising a recess formed therein, wherein the recess is spatially communicated with the accommodating space and overlapping with the first gap in a stacking direction of the ring structure and the lid, wherein a sidewall of the recess is aligned with the first side of the semiconductor die, and the sidewall of the recess is connected to and surrounds a perimeter of a top surface of the recess.