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US 11,637,071 B2Granted
Package structure including multiple dies surrounded by conductive element and manufacturing method thereof
AssigneePowertech Technology Inc.
InventorsShang-Yu Chang Chien, Nan-Chun Lin, Hung-Hsin Hsu
Life of this patent
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Abstract
A package structure, including a conductive element, multiple dies, a dielectric body, a circuit layer and a patterned insulating layer, is provided. The multiple dies are disposed on the conductive element. A portion of the conductive element surrounds the multiple dies. The dielectric body covers the multiple dies. The circuit layer is disposed on the dielectric body. The circuit layer is electrically connected to the multiple dies. The patterned insulating layer covers the circuit layer. A portion of the patterned insulating layer is disposed between the dies that are adjacent. A manufacturing method of a package structure is also provided.
Claims17
A package structure, comprising:
- a conductive element;
- a plurality of dies disposed on the conductive element, wherein a portion of the conductive element surrounds the plurality of dies;
- a dielectric body covering the plurality of dies;
- a circuit layer disposed on the dielectric body and electrically connected to the plurality of dies;
- and
- a patterned insulating layer covering the circuit layer, wherein a portion of the patterned insulating layer is disposed between the dies that are adjacent, wherein the conductive element comprises a first conductive portion and a second conductive portion, the dielectric body is disposed on the first conductive portion, the second conductive portion that surrounds each of the plurality of dies, wherein a side wall of the first conductive portion of the conductive element, a side wall of the second conductive portion of the conductive element and a side wall of the patterned insulating layer are substantially flush.
3 more elements
A package structure, comprising:
- a conductive element;
- a plurality of dies disposed on the conductive element, wherein a portion of the conductive element surrounds the plurality of dies;
- a dielectric body covering the plurality of dies;
- a circuit layer disposed on the dielectric body and electrically connected to the plurality of dies;
- and
- a patterned insulating layer covering the circuit layer, wherein a portion of the patterned insulating layer is disposed between the dies that are adjacent, wherein a portion of the conductive element comprises a second conductive portion that surrounds each of the plurality of dies, the patterned insulating layer surrounds the second conductive portion, and the patterned insulating layer is a single layer without an interface therein.
3 more elements
A package structure, comprising:
- a conductive element;
- a plurality of dies disposed on the conductive element, wherein a portion of the conductive element surrounds the plurality of dies;
- a dielectric body covering the plurality of dies;
- a circuit layer disposed on the dielectric body and electrically connected to the plurality of dies;
- and
- a patterned insulating layer covering the circuit layer, wherein a portion of the patterned insulating layer is disposed between the dies that are adjacent, wherein a maximum thickness of the patterned insulating layer is greater than a maximum thickness of the dielectric body, and the patterned insulating layer is a single layer without an interface therein.
3 more elements
A package structure, comprising:
- a conductive element;
- a plurality of dies disposed on the conductive element, wherein a portion of the conductive element surrounds the plurality of dies;
- a dielectric body covering the plurality of dies;
- a circuit layer disposed on the dielectric body and electrically connected to the plurality of dies;
- and
- a patterned insulating layer covering the circuit layer, wherein a portion of the patterned insulating layer is disposed between the dies that are adjacent, wherein
- the dielectric body has a dielectric top surface, a dielectric bottom surface, and a dielectric side surface, the dielectric bottom surface is opposite to the dielectric top surface, and the dielectric side surface is connected to the dielectric top surface and the dielectric bottom surface,
- the circuit layer is disposed on the dielectric top surface of the dielectric body,
- the conductive element comprises a first conductive portion and a second conductive portion, the dielectric body is disposed on the first conductive portion, and
- the second conductive portion at least covers the dielectric side surface, and the second conductive portion of the conductive element and the circuit layer are the same film layer with the same structure formed by the same process.
7 more elements
A manufacturing method of a package structure, comprising:
- providing a carrier having a conductive portion;
- disposing a plurality of dies on the conductive portion of the carrier;
- forming a dielectric material on the carrier to cover the plurality of dies;
- forming a dielectric body that covers the plurality of dies by removing at least a portion of the dielectric material;
- forming a patterned conductive layer on the dielectric body, and the patterned conductive layer comprising a circuit layer being electrically connected to the plurality of dies;
- forming a patterned insulating layer to cover the patterned conductive layer, and a portion of the patterned insulating layer is disposed between the dies that are adjacent, wherein the package structure, comprising:
- a conductive element, wherein a portion of the conductive element is formed by the conductive portion of the carrier;
- the plurality of dies disposed on the conductive element, wherein a portion of the conductive element surrounds the plurality of dies;
- the dielectric body covering the plurality of dies;
- the circuit layer disposed on the dielectric body and electrically connected to the plurality of dies;
- and
- the patterned insulating layer covering the circuit layer, wherein a portion of the patterned insulating layer is disposed between the dies that are adjacent, wherein the conductive element comprises a first conductive portion and a second conductive portion, the dielectric body is disposed on the first conductive portion, the second conductive portion that surrounds each of the plurality of dies, wherein a side wall of the first conductive portion of the conductive element, a side wall of the second conductive portion of the conductive element and a side wall of the patterned insulating layer are substantially flush.
9 more elements
A package structure, comprising:
- a conductive element;
- a plurality of dies disposed on the conductive element, wherein a portion of the conductive element surrounds the plurality of dies;
- a dielectric body covering the plurality of dies;
- a circuit layer disposed on the dielectric body and electrically connected to the plurality of dies;
- and
- a patterned insulating layer covering the circuit layer, wherein a portion of the patterned insulating layer is disposed between the dies that are adjacent, wherein
- the dielectric body has a dielectric top surface, a dielectric bottom surface, and a dielectric side surface, the dielectric bottom surface is opposite to the dielectric top surface, and the dielectric side surface is connected to the dielectric top surface and the dielectric bottom surface,
- the circuit layer is disposed on the dielectric top surface of the dielectric body,
- the conductive element comprises a first conductive portion and a second conductive portion,
- the dielectric body is disposed on the first conductive portion, and
- the second conductive portion is disposed on and covers a portion of the dielectric top surface, and extends and covers the dielectric side surface to contact the first conductive portion.
8 more elements
Dependencies are inferred from the claim text.