Advanced metal connection with metal cut

A method for fabricating a conductive interconnection layer of an integrated circuit, comprising:

• patterning a conductive connector portion on the conductive interconnection layer of the integrated circuit;
• cutting the conductive connector portion into a plurality of conductive connector sections separated by a cut width based on semiconductor elements disposed at intervals on a semiconductor layer of the integrated circuit;
• and
• fabricating a via interconnection that electrically connects one of the conductive connector sections to one of the semiconductor elements.

A method comprising:

• patterning a conductive interconnection layer to form a conductive connector portion;
• forming conductive connector sections from the conductive connector portion;
• fabricating a semiconductor device including a plurality of semiconductor structures below the conductive interconnection layer and separated by a predetermined pitch;
• and
• interconnecting one of the conductive connector sections and one of the semiconductor structures.