Wiring board and method of manufacturing the same

A method of manufacturing a wiring board, comprising:

• forming a first shade layer on an initial insulating layer, wherein the first shade layer has a first hollow pattern;
• forming a second shade layer on the first shade layer, wherein the second shade layer has a second hollow pattern different from the first hollow pattern, and a part of the first hollow pattern and a part of the second hollow pattern overlap;
• by using the first shade layer and the second shade layer as masks, etching the initial insulating layer, so as to form a first insulating layer having a plurality of recesses and a plurality of trenches, wherein the recesses are connected to the trenches, and the recesses extend from bottoms of the trenches in a direction away from the trenches;
• depositing a conductive material in the recesses and the trenches, so as to form a plurality of first conductive columns in the recesses and to form a first wiring layer in the trenches;
• and
• removing a part of the first insulating layer adjacent to the first conductive columns, so as to cause the first conductive columns to protrude from a surface of the first insulating layer.