Semiconductor device package

A semiconductor device package, comprising:

• a first substrate;
• a second substrate disposed over the first substrate;
• a first encapsulant connecting the first substrate to the second substrate;
• and
• a second encapsulant disposed between the first substrate and the second substrate, and configured to support the second substrate to prevent the second substrate from tilting with respect to the first substrate under a reflow process;
• wherein the second encapsulant is spaced apart from a connector connecting the first substrate to the second substrate.

A semiconductor device package, comprising:

• a first substrate;
• a second substrate disposed over the first substrate;
• a first encapsulant connecting the first substrate to the second substrate;
• and
• a second encapsulant disposed between the first substrate and the second substrate, and
• configured to support the second substrate to prevent the second substrate from tilting with respect to the first substrate under a reflow process;
• wherein the second encapsulant comprises a curved edge extending from a first edge of the first encapsulant to a second edge of the first encapsulant from a top view.

A semiconductor device package, comprising:

• a first substrate;
• a second substrate disposed over the first substrate;
• an electronic component disposed between the first substrate and the second substrate;
• a first encapsulant connecting the electronic component to the second substrate;
• a second encapsulant connecting the first substrate to the second substrate, wherein the first encapsulant and the second encapsulant comprise a same material;
• and
• a third encapsulant covering a top surface of the second substrate, wherein the third encapsulant comprises a first material and the second encapsulant comprise a second material different from the first material.

A semiconductor device package, comprising:

• a first substrate;
• a second substrate disposed over the first substrate;
• an electronic component disposed between the first substrate and the second substrate;
• a first encapsulant connecting the electronic component to the second substrate;
• a second encapsulant connecting the first substrate to the second substrate, wherein the first encapsulant and the second encapsulant comprise a same material;
• a plurality of first connectors connecting between the first substrate and the second substrate;
• and
• a plurality of second connectors disposed under a bottom surface of the first substrate, wherein at least one of the plurality of second connectors has a diameter greater than a diameter of at least one of the plurality of first connectors.

A semiconductor device package, comprising:

• a first substrate;
• a second substrate disposed over the first substrate;
• an electronic component disposed between the first substrate and the second substrate;
• a first encapsulant connecting the electronic component to the second substrate;
• a second encapsulant connecting the first substrate to the second substrate, wherein the first encapsulant and the second encapsulant comprise a same material;
• a plurality of first connectors connecting between the first substrate and the second substrate;
• and
• a plurality of second connectors disposed under a bottom surface of the first substrate, wherein a pitch of the plurality of first connectors is less than a pitch of the plurality of second connectors.