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US 11,637,052 B2Granted
Semiconductor device and semiconductor device manufacturing method
AssigneeFuji Electric Co., Ltd.
InventorNaoki Takizawa
Life of this patent
Estimating the term…
Abstract
A semiconductor device, including a metal base plate having a front surface on which a disposition area is set apart from a central portion of the metal base plate, and a board placed over the disposition area with a solder therebetween. The solder has two edge portions of which one is closer than the other to the central portion of the metal base plate, said one being thicker than said the other.
Claims6
A semiconductor device, comprising:
- a metal base plate having a front surface on which a disposition area is set apart from a central portion of the metal base plate;
- and
- a board placed over the disposition area with a solder therebetween, the solder having two edge portions, opposed to each other with respect to the central portion, of which one is farther than the other to the central portion of the metal base plate, said one being thicker than said the other, wherein
- the board has two edge portions, opposed to each other with respect to the central portion, of which one is farther than the other to the central portion of the metal base plate, the board being inclined so that the one edge portion thereof being higher than the other edge portion thereof in a side view of the semiconductor device.
1 more element
A semiconductor device comprising:
- a metal base plate having a front surface on which a disposition area is set apart from a central portion of the metal base plate;
- a board placed over the disposition area with a solder therebetween, the solder having two edge portions of which one is farther than the other to the central portion of the metal base plate, said one being thicker than said the other;
- a first protrusion formed at a first formation position on the disposition area;
- and
- a second protrusion formed at a second formation position on the disposition area, the second formation position being farther from the central portion than the first formation position, wherein:
- the first protrusion is in contact with a back surface of the board;
- and
- the second protrusion is longer than the first protrusion, and is in contact with the back surface of the board.
5 more elements
Dependencies are inferred from the claim text.