Integrated device coupled to a step heat sink configured to provide shielding

An apparatus comprising:

• a substrate;
• a first integrated device coupled to the substrate;
• a second integrated device coupled to the substrate;
• a frame coupled to the substrate,
• wherein the frame at least partially surrounds the first integrated device and the second integrated device,
• wherein the frame is configured to provide a first compartment and a second compartment,
• wherein at least part of the frame is located between the first integrated device and the second integrated device, and
• wherein the frame is coupled to the substrate such that (i) the first integrated device is located in the first component of the frame and (ii) the second integrated device is located in the second compartment of the frame, and
• wherein the frame is configured to provide electromagnetic interference (EMI) shielding between the first integrated device and the second integrated device;
• means for shielding coupled to at least part of the frame located between the first integrated device and the second integrated device;
• means for heat dissipation coupled to the frame,
• wherein the means for heat dissipation is located over the first integrated device and the second integrated device, and
• wherein the means for heat dissipation comprises:
• a first heat sink portion;
• a third heat sink portion coupled to the first heat sink portion;
• and
• a second heat sink portion coupled to the third heat sink portion;
• and
• means for phase transition heat dissipation coupled to the means for heat dissipation,
• wherein the means for phase transition heat dissipation is located over (i) the first integrated device and (ii) the first heat sink portion of the means for heat dissipation, and
• wherein the means for phase transition heat dissipation and the second heat sink portion of the means for heat dissipation are located in a same horizontal plane.