Semiconductor device having semiconductor chip formed on wiring part, and method of manufacturing the same

A method of manufacturing a semiconductor device, comprising:

• preparing a semiconductor chip including
• a first electrode on a rear surface thereof,
• a laminated substrate including an insulating board and a heat dissipation board laminated on a rear surface of the insulating board, and
• a case, including
• a frame surrounding an opening penetrating the case from a front surface of the case to a rear surface of the case, and
• a first terminal including a first connection part, a first linking part, and a first wiring part, the first connection part penetrating the frame and extending out of the frame, the first wiring part extending into the opening and having a wiring rear surface and a wiring front surface, the first linking part integrally linking the first connection part and the first wiring part;
• attaching the laminated substrate from the rear surface of the case to cover the opening, and disposing the first wiring part onto the insulating board of the laminated substrate with the wiring rear surface of the first wiring part facing a front surface of the insulating board;
• and
• bonding the first electrode of the semiconductor chip to the wiring front surface of the first wiring part.