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US 11,637,028 B2Granted
Method and apparatus for use in wafer processing
AssigneeInfineon Technologies AG
InventorsThomas Fischer, Gerald Lackner, Walter Horst Leitgeb, Michael Lecher
Life of this patent
Estimating the term…
Abstract
In an embodiment an apparatus includes a receptacle configured to receive a wafer, a light port configured to emit light from a source of light so as to shine the light on an edge of the wafer, wherein the light port is an opening located on a surface of the receptacle and a light sensitive element configured to receive light that passed the edge of the wafer and to form a detection signal based on the received light, wherein the light port is located underneath the wafer.
Claims19
An apparatus comprising:
- a receptacle configured to receive a wafer having an upper long side and a lower long side;
- a light port configured to emit light from a source of light so as to shine the light on an outer edge of the wafer, wherein the light port is an opening located on a surface of the receptacle, the outer edge of the wafer connecting the upper long side and the lower long side;
- and
- a light sensitive element configured to receive light that passed by the outer edge of the wafer and to form a detection signal based on the received light,
- wherein the light port is located underneath the wafer.
2 more elements
An apparatus comprising:
- a chuck base configured to support a wafer having an upper long side and a lower long side;
- a light port configured to emit light from a source of light so as to shine the light on an outer edge of the wafer, wherein the light port is an opening located on a surface of the chuck base, and wherein the light port is located underneath the wafer;
- and
- a light sensitive element configured to receive light that passed by the outer edge of the wafer to form a detection signal based on the received light, the outer edge of the wafer connecting the upper long side and the lower long side,
- wherein the chuck base comprises a rotation axis and a rim along a circumference of the chuck base,
- wherein the light port is located between the rim and the rotation axis,
- wherein the rim extends from an upper surface of the chuck base towards the wafer, the upper surface facing the wafer, and
- wherein the light port is located closer to the rim than to the rotation axis.
5 more elements
An apparatus comprising:
- a chuck base configured to support a wafer having an upper long side and a lower long side, wherein the chuck base comprises a rotation axis and a rim along a circumference of the chuck base, and wherein the rim extends from an upper surface of the chuck base towards the wafer, the upper surface facing the wafer;
- a light port configured to emit light from a source of light so as to shine the light on an outer edge of the wafer, wherein the outer edge of the wafer connects the upper long side and the lower long side, wherein the light port is an opening located on a surface of the chuck base, and wherein the light port is located underneath the wafer;
- and
- a light sensitive element configured to receive light that passed between the outer edge of the wafer and the rim to form a detection signal based on the received light.
1 more element
Dependencies are inferred from the claim text.