Method for glob top encapsulation using molding tape with elevated sidewall

A method of assembling a smart card, comprising:

• attaching an integrated circuit (IC) die to a die receiving area of a lead frame, wherein the lead frame comprises a first major surface with a plurality of exposed contacts and a second major surface having the die receiving area and one or more connection pads surrounding the die receiving area, wherein the connection pads enable electrical connections of the IC die to the exposed contacts, and a molding tape sized and shaped like the lead frame and having a first height above the second major surface, wherein the molding tape is adhered to and covers the second major surface of the lead frame, wherein the molding tape includes a die receiving area cut-out that exposes the die receiving area and the connection pads on the second major surface of the lead frame and forms a cavity for receiving an encapsulant that covers the IC die and the connection pads within the cavity, and wherein the cut-out includes an elevated sidewall having a second height above the second major surface, wherein the second height is higher than the first height, the elevated sidewall for retaining the encapsulant within the cavity;
• electrically connecting the IC die with the exposed contacts by way of the connection pads;
• and
• dispensing a liquid encapsulant into the cavity such that the encapsulant covers the IC die and the electrical connections of the IC die to the connection pads.