Counter electrode material for electrochromic devices
AssigneeView, Inc.
InventorsAnshu A. Pradhan, Robert T. Rozbicki, Dane Gillaspie, Sridhar K. Kailasam
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Abstract
Various embodiments herein relate to electrochromic devices, methods of fabricating electrochromic devices, and apparatus for fabricating electrochromic devices. In a number of cases, the electrochromic device may be fabricated to include a particular counter electrode material. The counter electrode material may include a base anodically coloring material. The counter electrode material may further include one or more halogens. The counter electrode material may also include one or more additives.
Claims12
An integrated deposition system for fabricating an electrochromic device stack, the integrated deposition system comprising:
- a plurality of deposition stations aligned in series and interconnected and operable to pass a substrate from one station to the next without exposing the substrate to an external environment, wherein the plurality of deposition stations comprises
- (i) a first deposition station containing a first one or more material sources for depositing a cathodically coloring layer;
- (ii) a second deposition station containing a second one or more material sources for depositing an anodically coloring layer,
- wherein the second one or more material sources for depositing the anodically coloring layer comprise at least a first metal and a halogen, the second one or more material sources for depositing the anodically coloring layer optionally comprising one or more additives,
- wherein the first metal is selected from the group consisting of chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), rhodium (Rh), and iridium (Ir), ruthenium (Ru), vanadium (V), and combinations thereof, and
- wherein the optional one or more additives are selected from the group consisting of silver (Ag), arsenic (As), gold (Au), boron (B), cadmium (Cd), cesium (Cs), copper (Cu), europium (Eu), gallium (Ga), gadolinium (Gd), germanium (Ge), mercury (Hg), osmium (Os), lead (Pb), palladium (Pd), promethium (Pm), polonium (Po), platinum (Pt), radium (Ra), rubidium (Rb), terbium (Tb), technetium (Tc), thorium (Th), thallium (Tl), tungsten (W), and combinations thereof;
- and
- a controller containing program instructions for passing the substrate through the plurality of deposition stations in a manner that deposits on the substrate (i) the cathodically coloring layer, and (ii) the anodically coloring layer to form a stack comprising at least the cathodically coloring layer and the anodically coloring layer.
Dependencies are inferred from the claim text.