Package and method of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Hsuan Tai, Chung-Ming Weng, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
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Abstract
An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.
Claims20
An integrated circuit package comprising:
- a photonic integrated circuit die, the photonic integrated circuit die comprising an optical coupler and a die connector adjacent to the optical coupler;
- an encapsulant encapsulating the photonic integrated circuit die;
- a first redistribution structure over the photonic integrated circuit die and the encapsulant, the first redistribution structure comprising a metallization pattern in physical contact with the die connector;
- and
- an opening exposing the optical coupler and a sidewall of the first redistribution-structure, wherein the opening extends into the photonic integrated circuit die.
An integrated circuit package comprising:
- an encapsulant having a first surface and a second surface opposite the first surface;
- a photonic integrated circuit die embedded in the encapsulant, the photonic integrated circuit die comprising an optical coupler, a first surface of the photonic integrated circuit die being level with the first surface of the encapsulant;
- a first redistribution structure on the first surface of the encapsulant, the first redistribution structure comprising a first metallization pattern;
- a second redistribution structure on the second surface of the encapsulant, the second redistribution structure comprising a second metallization pattern electrically coupled to the first metallization pattern;
- and
- an opening exposing the optical coupler, a sidewall of the opening extending through the first redistribution structure, wherein the opening extends into an interconnect structure of the photonic integrated circuit die.
An integrated circuit package comprising:
- a first redistribution structure comprising a first metallization pattern;
- a photonic integrated circuit die over the first redistribution structure, a backside of the photonic integrated circuit die being attached to the first redistribution structure, a front side of the photonic integrated circuit die comprising an optical coupler adjacent to a first sidewall of the photonic integrated circuit die;
- an encapsulant over the first redistribution structure, the encapsulant extending along and being in physical contact with a second sidewall of the photonic integrated circuit die, the first sidewall of the photonic integrated circuit die being free from the encapsulant, the second sidewall of the photonic integrated circuit die being opposite to the first sidewall of the photonic integrated circuit die;
- a second redistribution structure over and in electrical contact with the photonic integrated circuit die, the second redistribution structure comprising a second metallization pattern electrically coupled to the first metallization pattern;
- and
- an opening extending into photonic integrated circuit die and exposing the optical coupler.
Dependencies are inferred from the claim text.