Sensor device, method for manufacturing a sensor device and sensor assembly
AssigneeTDK Corporation
InventorMatthias König
Life of this patent
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Abstract
In an embodiment a sensor device includes a substrate with a first membrane and a first cover layer, the first membrane and the first cover layer being monolithically integrated into the substrate and a first pellistor element including a heater element and a temperature sensor element, the heater element and/or the temperature sensor element being arranged in or on the first membrane, wherein the first cover layer is arranged over or under the first membrane, and wherein the first membrane, the first cover layer and a part of the substrate surround a first cavity.
Claims20
A sensor device comprising:
- a substrate with a first membrane and a first cover layer, the first membrane and the first cover layer being monolithically integrated into the substrate;
- and
- a first pellistor element comprising a heater element and a temperature sensor element, the heater element and/or the temperature sensor element being arranged in or on the first membrane,
- wherein the first membrane, the first cover layer and a part of the substrate surround a first cavity, and
- wherein the first cover layer is arranged over or under the first membrane and extends over the first cavity.
A sensor device comprising:
- a substrate with a first membrane and a first cover layer, the first membrane and the first cover layer being monolithically integrated into the substrate;
- and
- a first pellistor element comprising a heater element and a temperature sensor element, the heater element and/or the temperature sensor element being arranged in or on the first membrane,
- wherein the first cover layer is arranged over or under the first membrane,
- wherein the first membrane, the first cover layer and a part of the substrate surround a first cavity,
- wherein the first cover layer is a gas barrier layer, and
- wherein a vacuum is present in the first cavity.
A sensor device comprising:
- a substrate with a first membrane and a first cover layer, the first membrane and the first cover layer being monolithically integrated into the substrate;
- and
- a first pellistor element comprising a heater element and a temperature sensor element, the heater element and/or the temperature sensor element being arranged in or on the first membrane,
- wherein the first cover layer is arranged over or under the first membrane,
- wherein the first membrane, the first cover layer and a part of the substrate surround a first cavity,
- wherein the substrate comprises a second cover layer, the second cover layer being monolithically integrated into the substrate and being arranged on a side of the first membrane opposite to the first cover layer.
Dependencies are inferred from the claim text.