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US 11,635,360 B2Granted
Method for evaluating binder
AssigneeSamsung Display Co., Ltd.
InventorsHyeon Deuk Hwang, Eun Joong Mun, Dong Yeon Lee, Hyung Don Na
Life of this patent
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Abstract
A method for evaluating a binder includes disposing the binder on a first plate, bringing a second plate, which faces the first plate, into contact with one surface of the binder, applying a stress to the binder through the second plate, measuring a strain of the binder due to the applied stress, and calculating a curing rate of the binder based on the strain of the binder.
Claims20
A method for evaluating a binder, the method comprising:
- disposing the binder on a first plate;
- bringing a second plate, which faces the first plate, into contact with one surface of the binder;
- applying a stress to the binder through the second plate;
- measuring a strain of the binder due to the applied stress;
- and
- calculating a curing rate of the binder based on the strain of the binder,
- wherein the applying the stress to the binder comprises applying at least one of a shear stress to the binder by rotating the second plate and a compressive stress to the binder by moving the second plate.
4 more elements
A method for evaluating a binder, the method comprising:
- disposing the binder on a first plate;
- bringing a second plate, which faces the first plate, into contact with one surface of the binder;
- applying a stress to the binder through the second plate;
- measuring a strain of the binder due to the applied stress;
- and
- determining whether the binder is defective by comparing the measured strain of the binder with a previously stored strain of a non-defective binder.
3 more elements
Dependencies are inferred from the claim text.